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- Intel® E3800 Series SoC Processors
- Fanless solution
- CPU TDP 8W to 10W
- System Memory support up to 8GB/DDR3L 1333MHz
- Windows 7, Windows 8, Windows 10, Linux Compatible
- 90 mm x 96 mm, PCIe/104 Form Factor
- Thermal design for easy assembly
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CPU |
Intel SoC E3845; Quad Core, 1.91 GHz, 2MB, 10W TDP, 22nm technology |
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| BIOS |
AMI BIOS |
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| System Memory |
Up to 8 GB DDR3L-1333; 1.35V SoDIMM204 Socket |
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| TDP |
CPU TDP 8W to 10W |
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| Ethernet |
2x 10/100/1000 Mbit Ethernet LAN Port; Intel i210 |
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| I/O |
2x RS232 COM Ports 8x USB 2.0 Total: 4x USB 2.0 Pin Connector 2x PCIe Connector 1x Mini PCIe Socket, 1x USB 3.0 (Backward Compatible to USB 2.0) 1x USB 3.0 |
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| SATA |
2x SATA 3 Gb/s; Shared with mSATA Socket |
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| Stacking connector |
Type 2 Downward-Stacking PCIe/104 V2.01 with 2x Gen2 PCIe x1 Lanes; LPC, SMBus, 2x USB 2.0 |
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| DIO |
Discrete 16bit GPIO Port; PCA9535BS, No Interrupt |
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| Audio |
7.1 HD Audio with SPDIF In/Out |
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| Display OUT |
Onboard VGA/DVI, DisplayPort/ HDMI |
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| Expansion |
PCI Express Mini Card 1.2 Socket; Compatible with Mini PCIe or mSATA Modules |
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| OS compatibility |
Windows 7, Windows 8, Windows 10, Linux Compatible |
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| Power Supply |
Input Power = 5VDC, 5VS (12VDC for PCIe/104 Connector) |
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| Temperature |
Operation: -25°C to +70°C Operation: -40°C - 85°C with ext. temp prescreening (Option)Operation: -40°C - 85°C |
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| Humidity |
operation: 5% - 95% non-condensing |
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| Dimensions |
90 mm x 96 mm, PCIe/104 Form Factor |
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| Weight |
GW: 100 g |
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Ordering Information:
ADLE3800PC-E3845
PCIE/104 SBC Atom E3845
ADL-ET-Prescreening
Temperature prescreening -40/+85°C
UNDERFILL
BGA underfill req’d for –40C operation
COATING
Conformal Coating
UNDERFILL / BONDING / COATING
Underfilling, Bonding, and Conformal Coating
